Specific Process Knowledge/Etch/OES: Difference between revisions

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* Pegasus 4
* Pegasus 4
The section below describes
The section below describes
{| {{table}}| align="center" style="background:#f0f0f0;"|'''Monitored species'''| align="center" style="background:#f0f0f0;"|'''Wavelength (nm)'''|-| Al||308.2, 309.3, 396.1|-| AlCl||261.4|-| As||235.0|-| C2||516.5|-| CF2||251.9|-| Cl||741.4|-| CN||289.8, 304.2, 387.0|-| CO||292.5, 302.8, 313.8, 325.3, 482.5, 483.5, 519.8|-| F||703.7, 712.8|-| Ga||417.2|-| H||486.1, 656.5|-| In||325.6|-| N||674.0|-| N2||315.9, 337.1|-| NO||247.9, 288.5, 289.3, 303.5, 304.3, 319.8, 320.7, 337.7, 338.6|-| O||777.2, 844.7|-| OH||281.1, 306.4, 308.9|-| S||469.5|-| Si||288.2|-| SiCl||287.1|-| SiF||440.1, 777.0|-| |}

Revision as of 12:59, 26 November 2020

Optical endpoint detection on the dry etch tools at DTU Nanolab

Several dry etch tools at DTU Nanolab are equipped with an endpoint detection system. Out of those systems only one is not of the type optical endpoint detection. The instruments are:

  • ICP Metal Etch
  • III-V ICP
  • Pegasus 1
  • Pegasus 4

The section below describes