Specific Process Knowledge/Etch: Difference between revisions
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*[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | *[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | ||
*[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | *[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | ||
*[[/DRIE-Pegasus| DRIE-Pegasus systems]] | *[[/DRIE-Pegasus| DRIE-Pegasus systems:]] | ||
**[[/DRIE-Pegasus/Pegasus-1| DRIE-Pegasus 1 (Si etching on 4" wafers)]] | **[[/DRIE-Pegasus/Pegasus-1| DRIE-Pegasus 1 (Si etching on 4" wafers)]] | ||
**[[/DRIE-Pegasus/Pegasus-2| DRIE-Pegasus 2 (Dedicated for research applications)]] | **[[/DRIE-Pegasus/Pegasus-2| DRIE-Pegasus 2 (Dedicated for research applications)]] | ||