Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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*Semi-automatic and manual operation | *Semi-automatic and manual operation | ||
*Bond placement laser pointer | *Bond placement laser pointer | ||
*recommended min. bonding area 100 µm | *recommended min. bonding area 100 µm x 100 µm | ||
*recommended temperature 120 <sup>o</sup>C. | *recommended temperature 120 <sup>o</sup>C. | ||
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Revision as of 10:33, 12 October 2020
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TPT Wire Bonder
Packlab, Building 347, 1st floor
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager:
Ball Wire Bonder K&S 4524
Packlab, Building 347, 1st floor
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
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