Specific Process Knowledge/Thin film deposition: Difference between revisions
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== Choose material to deposit == | == Choose material to deposit == | ||
=== Metals === | === Metals/elements === | ||
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|13 Al Aluminium | |||
|14 Si Silicon | |||
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|22 Ti Titanium | |||
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|24 Cr Chromium | |||
|28 Ni Nickel | |||
|29 Cu Copper | |||
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|46 Pd Palladium | |||
|47 Ag Silver | |||
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|50 Sn Tin | |||
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|73 Ta Tantalum | |||
|74 W Tungsten | |||
|78 Pt Platinum | |||
|79 Au Gold | |||
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=== Polymers === | === Polymers === |
Revision as of 09:31, 24 October 2007
Choose material to deposit
Metals/elements
13 Al Aluminium | 14 Si Silicon | |||||
22 Ti Titanium | 24 Cr Chromium | 28 Ni Nickel | 29 Cu Copper | |||
46 Pd Palladium | 47 Ag Silver | 50 Sn Tin | ||||
73 Ta Tantalum | 74 W Tungsten | 78 Pt Platinum | 79 Au Gold |
Polymers
- SU8
- Antistiction coating
- Topas
- PMMA
Other materials
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Lesker - Sputter tool
- Leybold - E-beam evaporator and multiple wafer tool
- Wordentec - E-beam evaporator, sputter and thermical evaporator
- Hummer - Gold sputtering system
- PECVD - Plasma Enhanced Chemical Vapor deposition
- B2 Furnace LPCVD Nitride - Deposition of silicon nitrid
- B3 Furnace LPCVD TEOS - Deposition of silicon oxide
- B4 Furnace LPCVD PolySilicon - Deposition of polysilicon
- MVD - Molecular Vapor Deposition