Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
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[[Image:Lesker_roughness_Bjarke.JPG|left|600px|thumb|Figure 1:Left: no RF bias (wafer 12) gives high roughness. Right: RF bias (Wafer 21) gives low roughness]] | [[Image:Lesker_roughness_Bjarke.JPG|left|600px|thumb|Figure 1:Left: no RF bias (wafer 12) gives high roughness. Right: RF bias (Wafer 21) gives low roughness]] | ||
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==Oxide insulation analysis== | ==Oxide insulation analysis== | ||