Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

@@ Line 63: / Line 63: @@
 Other studies on metals (NiFe/MnIr)  show only limited effect of the substrate bias on the roughness.
+===From SiO2 target (RF sputter)===
 {| {{table}} border="1" cellspacing="0" cellpadding="8"
 | align="center" style="background:#f0f0f0;"|'''Wafer nr'''
@@ Line 79: / Line 81: @@
 | 8||15||0||157||0,122||40
 |-
-|
 |}
+===From Si target (DC sputter)===
 {| {{table}} border="1" cellspacing="0" cellpadding="8"
 | align="center" style="background:#f0f0f0;"|'''Wafer nr'''
@@ Line 102: / Line 105: @@
 | 22||15||9||90||0,509||
 |-
-|
 |}
+===Ta===
 {| {{table}} border="1" cellspacing="0" cellpadding="8"
 | align="center" style="background:#f0f0f0;"|'''Wafer nr'''
@@ Line 129: / Line 133: @@
 | 31||30||0||180||0,3||
 |-
-|
 |}