Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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'''**''' ''To deposit a cumulative thickness above 200 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine'' | '''**''' ''To deposit a cumulative thickness above 200 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine'' | ||
==Quality control of e-beam evaporated Ni films== | |||
{| border="1" cellspacing="2" cellpadding="2" colspan="3" | |||
|bgcolor="#98FB98" |'''Quality control (QC) for Wordentec''' | |||
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*[http://labmanager.dtu.dk/d4Show.php?id=3736&mach=167 QC procedure for Wordentec]<br> | |||
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=167 The newest QC data for Wordentec]<br> | |||
{| {{table}} | |||
| align="center" | | |||
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:300px" | |||
! QC Recipe: | |||
! Process 5 | |||
|- | |||
|Deposition rate | |||
|10 Å/s | |||
|- | |||
|Thickness | |||
|100 nm | |||
|- | |||
|Pressure | |||
|Below 4*10<sup>-6</sup> mbar | |||
|- | |||
|} | |||
| align="center" valign="top"| | |||
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px" | |||
!QC limits | |||
!Wordentec | |||
|- | |||
|Measured average thickness (Å) | |||
|± 10 % | |||
|- | |||
|Lowest accepted deposition rate (Å/s) | |||
|6 Å/s | |||
|- | |||
|} | |||
|- | |||
|} | |||
Thickness is measured in 5 points with a stylus profiler. | |||
|} | |||
{| border="1" cellspacing="2" cellpadding="2" colspan="3" | |||
|bgcolor="#98FB98" |'''Quality control (QC) for the Temescal''' | |||
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| | |||
*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure for the Temescal]<br> | |||
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=429 The newest QC data for the Temescal]<br> | |||
{| {{table}} | |||
| align="center" | | |||
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px" | |||
! QC Recipe: | |||
! Standard recipes/Ni | |||
|- | |||
|Deposition rate | |||
|10 Å/s | |||
|- | |||
|Thickness | |||
|100 nm | |||
|- | |||
|Pressure | |||
|Below 1*10<sup>-6</sup> mbar | |||
|- | |||
|} | |||
| align="center" valign="top"| | |||
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px" | |||
!QC limits | |||
!Temescal | |||
|- | |||
|Deposition rate deviation | |||
|± 20 % | |||
|- | |||
|Measured average thickness | |||
|± 10 % | |||
|- | |||
|Thickness deviation across a 4" wafer | |||
|± 5 % | |||
|- | |||
|} | |||
|- | |||
|} | |||
Thickness is measured in 5 points with a stylus profiler. <br> | |||
Additionally we examine the newly deposited films for particles using the particle scanner (if available, otherwise we use the Jenatech microscope in darkfield mode) and we monitor the sheet resistance of the Ti/Au films. | |||
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