Specific Process Knowledge/Thin film deposition: Difference between revisions

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Oh no! My material is not on the list! Please contact the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if you would like to inquire about a material that is not mentioned here.


== Choose deposition equipment ==
== Choose deposition equipment ==

Revision as of 23:25, 8 August 2020

3rd Level - Material/Method

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Choose material to deposit

Semiconductors Oxides Nitrides Metals Alloys Transparent conductive oxides Polymers

Silicon
Germanium

Aluminium Oxide (Al2O3)
Barium titanate (BaTiO3)
Chromium Oxide (Cr2O3)
Hafnium Oxide (HfO2)
Silicon Oxide (SiO2)
Titanium Oxide (TiO2)
Tantalum Oxide (Ta2O5)
Zinc Oxide (ZnO)


Silicon Nitride - and oxynitride
Titanium Nitride - conductive ceramics
Aluminum Nitride (AlxNy)


Aluminium
Chromium
Cobalt
Copper
Gold
Iron
Magnesium
Molybdenum
Nickel
Niobium
Palladium
Platinum
Ruthenium
Silver
Tantalum
Tin
Titanium
Tungsten
Zinc


AlCu
CoFe
CuTi
FeMn
MnIr
NbTi
NiCo
NiFe
NiV alloy
TiW alloy (10%/90% by weight)

And an electroceramic:

YSZ (Yttrium stabilized zirconia)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.

Choose deposition equipment

PVD LPCVD PECVD ALD Coaters Others



  • ALD1 - Atomic Layer Deposition (thermal)
  • ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers