Specific Process Knowledge/Lithography/Coaters: Difference between revisions
| Line 215: | Line 215: | ||
*Silicon | *Silicon | ||
*Glass | *Glass | ||
No resist or crystalbond allowed in the HMDS module | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Silicon | *Silicon | ||
| Line 222: | Line 224: | ||
*III-V materials | *III-V materials | ||
*Glass | *Glass | ||
No resist or crystalbond allowed in the HMDS module | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*All cleanroom materials except III-V materials | *All cleanroom materials except III-V materials | ||