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Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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==Quality control (QC) procedure for the Thermal evaporator [[Image:section under construction.jpg|70px]]==
==Quality control (QC) procedure for the Thermal evaporator==


{| border="1" cellspacing="2" cellpadding="2" colspan="3"
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
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|-
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[[Image:section under construction.jpg|70px]]
*[http://labmanager.dtu.dk/d4Show.php?id=6654&mach=404 QC procedure for the Thermal Evaporator]<br>
*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=404 QC procedure for the Thermal Evaporator]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=404 The newest QC data for the Thermal evaporator]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=404 The newest QC data for the Thermal evaporator]<br>


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!QC limits
!QC limits
!Temescal
!Temescal
|-
|Measured average thickness
|± 20 %
|-
|-
|Deposition rate deviation
|Deposition rate deviation
|± 50 % after stabilizing
|± 50 % after stabilizing
|-
|Measured average thickness
|± 20 %
|-
|-
|Thickness deviation across a 4" wafer
|Thickness deviation across a 4" wafer
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