Specific Process Knowledge/Thin film deposition: Difference between revisions
→Choose material to deposit: added materials for cluster sputterer |
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[[/Lesker|AlCu]]<br/> | [[/Lesker|AlCu]]<br/> | ||
[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|BaTiO<sub>3</sub>]] (Barium titanate)<br/> | |||
[[/Lesker|CoFe]]<br/> | [[/Lesker|CoFe]]<br/> | ||
[[/Lesker|CuTi]]<br/> | [[/Lesker|CuTi]]<br/> | ||
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[[/Deposition of NiV|NiV]] alloy <br/> | [[/Deposition of NiV|NiV]] alloy <br/> | ||
[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/> | [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/> | ||
[[/ | [[/Lesker|YSZ]] (Yttrium stabilized zirconia)<br/> | ||
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