Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
→Sputtering of Aluminium: corrected reference to cluster sputter system |
m →Comparison of Al deposition options: corrected deposition rate value |
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|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s | |Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s | ||
|Depending on process parameters at least up to | |Depending on process parameters at least up to 0.5 Å/s | ||
|Depending on process parameters at least up to | |Depending on process parameters at least up to 1.3 Å/s | ||
|~1. | |~1.5 Å/s to 2 Å/s | ||
|0.5, 1, or 2 Å/s | |0.5, 1, or 2 Å/s | ||
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