Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
→Thermal deposition of Aluminium: Added sputter options (old and new lesker were both missing from table) |
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Pumpdown approx. 1 hour. | Pumpdown approx. 1 hour. | ||
| Pumpdown approx. 1 hour. | | Pumpdown approx. 1 hour. | ||
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|'''***'''Thickness above 120 nm: ask for permission | |'''***'''Thickness above 120 nm: ask for permission | ||
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'''*''' ''For thicknesses above 600 nm please get permission from ThinFilm group by writing to metal@ | '''*''' ''For thicknesses above 600 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk'' | ||
'''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@ | '''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk'' | ||
'''***''' ''For thicknesses above 120 nm please get permission from ThinFilm group by writing to thinfilm@ | '''***''' ''For thicknesses above 120 nm please get permission from ThinFilm group by writing to thinfilm@nanolab.dtu.dk'' | ||
==Aluminium deposition on ZEP520A for lift-off - comparison of thermal and e-beam evaporation == | ==Aluminium deposition on ZEP520A for lift-off - comparison of thermal and e-beam evaporation == | ||