Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing: Difference between revisions
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As expected from Aligner Maskless 01 and 02, the accuracy of flat alignment is ±0.1°, and the substrate centering is within a couple of hundred µm. | As expected from Aligner Maskless 01 and 02, the accuracy of flat alignment is ±0.1°, and the substrate centering is within a couple of hundred µm. | ||
==Labeling== | |||
[[Image:MLA150_label.JPG|400x400px|thumb|An example of wafer ID produced by the labeling function]] | |||
The conversion manager software allows for inclusion of labels during the design conversion process. The labels are configured in a .lbl tab-delimited ASCII file with a special header in the first row, which must be located in the 'HIMT\Designs\Labels' folder. When used, the labels defined in the label file will be merged with the pattern in the source file, and the result can be inspected in the viewer. The X and Y positions of the labels should be given in design coordinates, and will be subject to any offsets/shifts applied to the design. Note, that if the label file is changed, the job file will not update automatically. | |||
'''Example of a label file:''' | |||
X | Y | UNIT | HEIGHT | UNIT | TITLE | |||
-16000 | -46000 | um | 2000 | um | TARAN DTU Nanolab 20190320 | |||
This produces a 2mm high, approximately 32mm long wafer ID at the flat of a 4" wafer. Some special characters are not allowed (e.g. ';'). | |||
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==Large defocus range== | ==Large defocus range== | ||