Jump to content

Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions

← Older editNewer edit →
VisualWikitext
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,794 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,794 edits
Line 178: Line 178:
==Defocus==
==Defocus==


The autofocus mode (optical or pneumatic) is selected via the substrate template.
Aligner: Maskless 02 offers two autofocus modes; optical or pneumatic. The autofocus mode is selected via the substrate template. The defocus process parameter is used to compensate for offsets between the autofocus mechanism and the focal point of the exposure light, as well as to optimize print quality in different resists and varying thicknesses.


'''Optical:''' Varies greatly with resist type and thickness, see [[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]]. Probably also dependent on substrate. Should work for substrates down to 3x3mm<sup>2</sup>.
'''Optical:''' Varies greatly with resist type and thickness, see [[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]]. Probably also dependent on substrate. Should work for substrates down to 3x3mm<sup>2</sup>.
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing"