Specific Process Knowledge/Thermal Process: Difference between revisions
| Line 25: | Line 25: | ||
'''Other furnaces:''' | '''Other furnaces:''' | ||
*[[/Furnace: Multipurpose annealing |Furnace: Multipurpose annealing ]] - ''For annealing, oxidation and resist pyrolysis'' | *[[/Furnace: Multipurpose annealing |Furnace: Multipurpose annealing ]] - ''For annealing, oxidation and resist pyrolysis'' | ||
*[[/Jipelec RTP|Jipelec RTP]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | *[[/Jipelec RTP|RTP Jipelec]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | ||
*[[/RTP Jipelec 2|RTP Jipelec 2]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | |||
*[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers'' | *[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers'' | ||
== Rules for storage and RCA cleaning of wafers to the A and C stack furnaces == | == Rules for storage and RCA cleaning of wafers to the A and C stack furnaces == | ||