Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride: Difference between revisions
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== Deposition of Titanium nitride == | == Deposition of Titanium nitride == | ||
Thin films of titanium nitride can be deposited by [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)|ALD]] and [[Specific Process Knowledge/Thin film deposition/Lesker| | Thin films of titanium nitride can be deposited by [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)|ALD]] and [[Specific Process Knowledge/Thin film deposition/Lesker|sputtering]] methods. | ||
Information about the ALD process can be found [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN deposition using ALD2|here]]. | Information about the ALD process can be found [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN deposition using ALD2|here]]. |
Revision as of 14:38, 6 April 2020
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Deposition of Titanium nitride
Thin films of titanium nitride can be deposited by ALD and sputtering methods.
Information about the ALD process can be found here.
Information about the sputtering process can be found here.
Comparison between sputtering and ALD methods for deposition of Titanium Nitride.
ALD2 | Sputter System Lesker | |
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Generel description |
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Stoichiometry |
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Film Thickness |
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Deposition rate |
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Step coverage |
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Process Temperature |
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Substrate size |
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Allowed materials |
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