Specific Process Knowledge/Etch/DRIE-Pegasus/System-description: Difference between revisions
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== Description of the Bosch process at the DRIE-Pegasus == | == Description of the Bosch process at the DRIE-Pegasus == | ||
--[[User:jmli|jmli]] ([[User talk:jmli|talk]]) 26 November 2012 | --[[User:jmli|jmli]] ([[User talk:jmli|talk]]) 26 November 2012 | ||
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This section applies to Pegasus 1, 2, 3 and 4. For Pegasus 4, however, it is less important as dielectrics etches are continuous/ | |||
The DRIE-Pegasus tools take the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. During each cycle the process parameters are kept constant: | The DRIE-Pegasus tools take the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. During each cycle the process parameters are kept constant: | ||