Specific Process Knowledge/Thin film deposition: Difference between revisions
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*Alcatel - ''E-beam evaporator and sputter tool'' | *Alcatel - ''E-beam evaporator and sputter tool'' | ||
*Lesker - ''Sputter tool'' | |||
*Leybold - ''E-beam evaporator and multiple wafer tool'' | *Leybold - ''E-beam evaporator and multiple wafer tool'' | ||
*Wordentec - '' | *Wordentec - ''E-beam evaporator, sputter and thermical evaporator'' | ||
*Hummer - ''Gold sputtering system'' | *Hummer - ''Gold sputtering system'' | ||
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | ||