Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions

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-The Cleaver: Lattice Axe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
+'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/LatticeAxe click here]'''
+The Cleaver: LatticeAxe a scriber designed for cleaving/scribing wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving.
+The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
 [[File:LatticeAxe placer prøve.JPG|400px]]
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 *Sapphire
-The LatticeAxe can cleave samples from 100mm down to 10mm. In some cases it can even be used on 150mm samples please contact wetchemistry group for more information
+The LatticeAxe can cleave samples from 100mm down to 10mm. In some cases it can even be used on larger samples please contact wetchemistry group for more information
+DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlexScribe FlexScribe]''' and the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlipScribe Flipscribe]''' for more information.