Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions
No edit summary |
No edit summary |
||
| Line 2: | Line 2: | ||
'''Approved Materials''': | '''Approved Materials''': | ||
Si | |||
Quartz | Quartz | ||
Pyrex (Borofloat 33) | Pyrex (Borofloat 33) | ||
GaAs | GaAs | ||
InP | InP | ||
Sapphire | Sapphire | ||
Revision as of 13:59, 31 March 2020
The Cleaver: Lattice Axe is designed for cleaving wafers into smaller pieces. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
Approved Materials: Si Quartz Pyrex (Borofloat 33) GaAs InP Sapphire