Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions
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Si | Si | ||
Quartz | Quartz | ||
Pyrex (Borofloat 33) | Pyrex (Borofloat 33) | ||
GaAs | GaAs | ||
InP | InP | ||
Sapphire | Sapphire | ||
Revision as of 13:56, 31 March 2020
The Cleaver: Lattice Axe is designed for cleaving wafers into smaller pieces. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
Approved Materials:
Si Quartz Pyrex (Borofloat 33) GaAs InP Sapphire