Revision as of 13:18, 26 March 2020

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Deposition of Cu

Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Temescal)	Sputter deposition (Lesker)
General description	E-beam deposition of Cu (line-of-sight deposition)	Sputter deposition of Cu (not line-of-sight deposition)
Pre-clean	Ar ion bombardment	RF Ar clean
Layer thickness	10Å to 1µm*	10Å to 1µm**
Deposition rate	1Å/s to 10Å/s	~1Å/s
Batch size	Up to 4x6" wafers Up to 3x8" wafers (ask for holder) smaller pieces	smaller pieces Up to 1x6" wafers
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals See also the cross-contamination sheet	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals
Comment	As of March 2020, Cu has not yet been deposited in this machine. Please contact the Thin Film group to develop a process.

** To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)

* To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)

Roughness of Cu layers - Roughness of Cu layers deposited with the Alcatel e-beam evaporator

Stress in sputtered Cu - Low stress in Cu films sputtered with the Sputter-System (Lesker)

Revision as of 13:17, 26 March 2020 view source Reet (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 1,409 edits →‎Studies of Cu deposition processes ← Older edit		Revision as of 13:18, 26 March 2020 view source Reet (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 1,409 edits m →‎Studies of Cu deposition processes Newer edit →
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	[[/Deposition of Copper\|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator''		[[/Deposition of Copper\|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator''

	[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cu:_Low_stress\|Stress in sputtered Cu]] - ''Low stress in Cu films sputtered with the Sputter-System (Lesker)'']]		[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cu:_Low_stress\|Stress in sputtered Cu]] - ''Low stress in Cu films sputtered with the Sputter-System (Lesker)''