Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ||
* '''Spin Coater''': Do you wish to use a manual spin coater or | * '''Spin Coater''': Do you wish to use a manual spin coater or an automatic spin coater? See a list of spin coaters <u>[[Specific_Process_Knowledge/Lithography/Coaters|here]]</u>. | ||
*'''Exposure''': Choose which aligner you wish to use, and consider the exposure dose. | *'''Exposure''': Choose which aligner you wish to use, and consider the exposure dose. | ||