Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
| Line 7: | Line 7: | ||
== LESKER Sputter Tool== | == LESKER Sputter Tool== | ||
The purpose of the "Sputter system (Lesker)" is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time. | The purpose of the "Sputter-system (Lesker)" is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time. | ||
It can be a problem to take wafers from the sputter and into the other machines in the cleanroom, since it is not very clean. In principle the sputter should be the last step before you take your wafers out of the cleanroom. If you need to take process your wafers further please contact the Thin Film group so they can help you. | It can be a problem to take wafers from the sputter and into the other machines in the cleanroom, since it is not very clean. In principle the sputter should be the last step before you take your wafers out of the cleanroom. If you need to take process your wafers further please contact the Thin Film group so they can help you. | ||