Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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'''**''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@ | '''**''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)'' | ||
'''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@ | '''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)'' | ||
== Studies of Cu deposition processes == | == Studies of Cu deposition processes == | ||
[[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' | [[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' | ||