Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions

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	== Deposition of Cu ==		== Deposition of Cu ==
	Copper can be deposited by e-beam evaporation, sputtering ~~or electroplating~~. In the chart below you can compare the different deposition equipment.		Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment.