Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing: Difference between revisions
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''Sequence names and process parameters (Sequence no. 3000-3999):'' | ''Sequence names and process parameters (Sequence no. 3000-3999):'' | ||
*'''DCH 100mm PEB60s@110C+SP60s''' | *'''(3001) DCH 100mm PEB60s@110C+SP60s''' | ||
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 60s' development. | A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 60s' development. | ||
*'''DCH 100mm PEB60s@110C+SP30s''' | *'''(3005) DCH 100mm PEB60s@110C+SP30s''' | ||
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 30s' development. | A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 30s' development. | ||
*'''DCH 150mm PEB60s@110C+SP60s''' | *'''(3010) DCH 150mm PEB60s@110C+SP60s''' | ||
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 150mm SP 60s' development. | A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 150mm SP 60s' development. | ||