Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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There are 76 developed and tested process recipes for general users (48 for PC1 and 28 for PC3). They include convenient and reative DC, RF and PulseDC sputtering with or without substrate bias. Deposition using HiPIMS can only be done with DTU Nanolab staff assistance. Starting the recipe the user can change the relevant process parameters: power, pressure, reactive gas ratio, rotation speed, substrate bias etc. In addition to the process recipes, there are also recipes for substrate heating and RF cleaning. | There are 76 developed and tested process recipes for general users (48 for PC1 and 28 for PC3). They include convenient and reative DC, RF and PulseDC sputtering with or without substrate bias. Deposition using HiPIMS can only be done with DTU Nanolab staff assistance. Starting the recipe the user can change the relevant process parameters: power, pressure, reactive gas ratio, rotation speed, substrate bias etc. Each of these 76 recipes has a uniqe name which indicate the process chamber, type of sputtering (DC, RF, or Pulse DC) gas flow control, the type of reactive gas and the presence of substrate bias. In addition to the standard process recipes, there are also recipes for substrate heating and RF cleaning. | ||