Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
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*Up to 1x4" wafers | *Up to 1x4" wafers | ||
*smaller pieces | *smaller pieces | ||
| | | | ||
*6x6" wafers or | *6x6" wafers or | ||
| Line 22: | Line 18: | ||
| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
| Layer thickness | | Layer thickness | ||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 0.5µm (0.5µm not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|1Å to 10 Å/s | |1Å to 10 Å/s | ||
|- | |- | ||
Revision as of 14:44, 15 August 2011
Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | Thermal evaporation (Wordentec) | |
|---|---|---|
| Batch size |
|
|
| Pre-clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm (0.5µm not on all wafers) |
| Deposition rate | 2Å/s to 15Å/s | 1Å to 10 Å/s |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec