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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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==Distribution Chamber (Genmark robot)==
==Distribution Chamber (Genmark robot)==


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The load-lock and process chambers PC1 and PC3 are all connected thorough the common distribution chamber. The robot arm can trasfer the sample to the selected distanation. During normal operation, the chamber is pumped to a base pressure enuring the safe transfer of the sample between chambers and loadlock without breaking vacuum.




<gallery caption="Deposition rates of HfO2 at different temperaturs. ALD window." widths="800px" heights="300px" perrow="2">
<gallery caption="Deposition rates of HfO2 at different temperaturs. ALD window." widths="800px" heights="300px" perrow="2">
image:arm_robot_distribution_chamber.png| Deposition rate of HfO<sub>2</sub> at 150 <sup>o</sup>C. Substrate: Silicon 6" wafer with native oxide.
image:arm_robot_distribution_chamber.png| The photography of the distribution chamber with and without the top cover.
</gallery>
</gallery>


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