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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
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!style="background:silver; color:black;" align="center" |MD PC1 Src2 RF Upstream
!style="background:silver; color:black;" align="center" |MD PC1 Src2 RF Upstream


|style="background:LightGrey; color:black" align="center"|'''SiO<sub>2</sub>'''<!--<b>-->
|style="background:LightGrey; color:black" align="center"|'''SiO<sub>2</sub>'''


|style="background:WhiteSmoke; color:black" align="center"|3
|style="background:WhiteSmoke; color:black" align="center"|3
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