Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
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*Up to 1x4" wafers | *Up to 1x4" wafers | ||
*smaller pieces | *smaller pieces | ||
| | | | ||
*24x2" wafers or | *24x2" wafers or | ||
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| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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| Layer thickness | | Layer thickness | ||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 1µm | |10Å to 1µm | ||
|. | |. | ||
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| Deposition rate | | Deposition rate | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]] | |Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]] |
Revision as of 14:38, 15 August 2011
Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment.
E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter deposition (Wordentec) | |
---|---|---|---|
Batch size |
|
|
|
Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean |
Layer thickness | 10Å to 1µm | 10Å to 1µm | . |
Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | Depending on process parameters, see here. |
Studies of Cr deposition processes
Uniformity of Cr layers - Uniformity of Cr layers deposited with different methods and settings
Sputtering of Cr in Wordentec - Settings and deposition rates