Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

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!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Leybold|Leybold]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
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*Up to 1x4" wafers
*Up to 1x4" wafers
*smaller pieces
*smaller pieces
|
*8x4" wafers or
*5x6" wafers
|
|
*24x2" wafers or  
*24x2" wafers or  
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| Pre-clean
| Pre-clean
|RF Ar clean
|RF Ar clean
|Ar ion bombartment
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
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| Layer thickness
| Layer thickness
|10Å to 1µm  
|10Å to 1µm  
|10Å to 0.5µm
|10Å to 1µm
|10Å to 1µm
|.
|.
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| Deposition rate
| Deposition rate
|2Å/s to 15Å/s
|2Å/s to 15Å/s
|1Å/s to 5Å/s
|10Å/s to 15Å/s
|10Å/s to 15Å/s
|Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]]
|Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]]

Revision as of 14:38, 15 August 2011

Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Wordentec) Sputter deposition (Wordentec)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Pre-clean RF Ar clean RF Ar clean RF Ar clean
Layer thickness 10Å to 1µm 10Å to 1µm .
Deposition rate 2Å/s to 15Å/s 10Å/s to 15Å/s Depending on process parameters, see here.


Studies of Cr deposition processes

Uniformity of Cr layers - Uniformity of Cr layers deposited with different methods and settings

Sputtering of Cr in Wordentec - Settings and deposition rates