Specific Process Knowledge/Thin film deposition/Deposition of Titanium

Titanium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Leybold)	E-beam evaporation (Wordentec)	Sputter deposition (Wordentec)
Batch size	Up to 1x4" wafers smaller pieces	8x4" wafers or 5x6" wafers	24x2" wafers or 6x4" wafers or 6x6" wafers	24x2" wafers or 6x4" wafers or 6x6" wafers
Pre-clean	RF Ar clean	Ar ion bombartment	RF Ar clean	RF Ar clean
Layer thickness	10Å to 1µm	10Å to 0.5µm	10Å to 1 µm	.
Deposition rate	2Å/s to 15Å/s	1Å/s to 5Å/s	10Å/s to 15Å/s	.

Comments: Choise of equipment

Thick layers

Comments: Adhesion layer

Ti as adhesion layer