Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions

Revision as of 12:06, 20 March 2020 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,579 edits →How to improve this ← Older edit		Revision as of 12:06, 20 March 2020 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,579 edits →How to improve this Newer edit →
Line 126:		Line 126:

	'''Stabilize the pressure'''		'''Stabilize the pressure'''

	Changing the pressure in the plasma has a great impact on the RF matching conditions as illustrated for [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description#Why_RF_matching_is_extremely_important_in_the_Bosch_process \| an oxygen plasma]] elsewhere. The obvious place to start is therefore the pressure. Also, it barely makes sense to claim that the pressure is 20 mtorr in the dep phase if it oscillates as shown for the Process D4 above.		Changing the pressure in the plasma has a great impact on the RF matching conditions as illustrated for [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description#Why_RF_matching_is_extremely_important_in_the_Bosch_process \| an oxygen plasma]] elsewhere. The obvious place to start is therefore the pressure. Also, it barely makes sense to claim that the pressure is 20 mtorr in the dep phase if it oscillates as shown for the Process D4 above.