Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions
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== Optimizing recipes with Picoscope == | == Optimizing recipes with Picoscope == | ||
Continuous processes do not benefit from the Picoscope in the same way that Bosch processes do. This is why | Continuous processes do not benefit from the Picoscope in the same way that Bosch processes do. This is why a Picoscope has not been installed on Pegasus 3 that runs continuous etch processes of dielectrics. For the Bosch processes, however, the situation is different. Optimizing multiplexed processes without the Picoscope now feels somewhat like studying biology samples without the the optical microscope. So many details in the etch processes are invisible without the Picoscope that it becomes meaningless to optimize Bosch processes without it. | ||
The downside of having a much more detailed view of the process is that it is very time consuming to arrive a minimum of reflected powers. | The downside of having a much more detailed view of the process is that it is very time consuming to arrive a minimum of reflected powers. Small changes in setpoints of the matching units can have dramatic impact. Quite often it is necessary to introduce shoulders on changes in gas flows to soften the transition in plasma conditions. As a result, the number of parameters in the recipes increases a lot. | ||
= New recipes= | = New recipes= | ||