Jump to content

Specific Process Knowledge/Lithography: Difference between revisions

Taran (talk | contribs)
Taran (talk | contribs)
Line 351: Line 351:
*Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual]
*Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual]
*Manual E-beam Developer: [http://labmanager.dtu.dk/d4Show.php?id=5070&mach=341 Developer: E-beam Manual]
*Manual E-beam Developer: [http://labmanager.dtu.dk/d4Show.php?id=5070&mach=341 Developer: E-beam Manual]


'''<big>Process Flows</big>'''
'''<big>Process Flows</big>'''
*[[:Media:Process_Flow_TPT first print.pdf|TPT first print process flow]]
*[[:Media:Process_Flow_TPT first print.pdf|TPT first print process flow]]
*[[:Media:Process_Flow_TPT alignment.pdf|TPT alignment process flow]]
*[[:Media:Process_Flow_TPT alignment.pdf|TPT alignment process flow]]
*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV resist process flows]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_Flows|E-beam resist process flows]]


| style="width: 20%"|
| style="width: 20%"|