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Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

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Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
m →Sputtering of TiW: added link to grain size study
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Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).


* [[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
*[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
 
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]


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