Specific Process Knowledge/Thin film deposition/ALD2 (PEALD): Difference between revisions
| Line 8: | Line 8: | ||
== Thermal ALD and PEALD == | == Thermal ALD and PEALD == | ||
[[image:ALD2.jpg|450x450px|right|thumb|ALD 2 (PEALD) | [[image:ALD2.jpg|450x450px|right|thumb|ALD 2 (PEALD). Positioned in cleanroom F-2.]] | ||
The ALD 2 (PEALD) is used to deposit very thin and uniform layers of different materials, by use of thermal ALD (Atomic Layer Deposition) or PEALD (Plasma Enhanced ALD). | The ALD 2 (PEALD) is used to deposit very thin and uniform layers of different materials, by use of thermal ALD (Atomic Layer Deposition) or PEALD (Plasma Enhanced ALD). | ||