Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*HMDS priming | *HMDS priming | ||
*Spin coating of PGMEA based UV resists | *Spin coating of PGMEA based UV resists | ||
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!style="background:silver; color:black;" align="center" width="60"|Resist | !style="background:silver; color:black;" align="center" width="60"|Resist | ||
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* AZ MiR 701 (29cps) | * AZ MiR 701 (29cps) | ||
* AZ nLOF 2020 | * AZ nLOF 2020 | ||
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|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
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* AZ MiR 701: 1.5-4 µm | * AZ MiR 701: 1.5-4 µm | ||
* AZ nLOF 2020: 1.5-5 µm | * AZ nLOF 2020: 1.5-5 µm | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
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* 50 mm wafers <sup>1)</sup> | * 50 mm wafers <sup>1)</sup> | ||
* 100 mm wafers | * 100 mm wafers | ||