Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*Spin coating of SU-8 resists | *Spin coating of SU-8 resists | ||
*Spin coating of PGMEA based AZ resists | *Spin coating of PGMEA based AZ resists | ||
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!style="background:silver; color:black;" align="center" width="60"|Resist | !style="background:silver; color:black;" align="center" width="60"|Resist | ||
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* manual dispense | * manual dispense | ||
* automatic dispense from syringe | * automatic dispense from syringe | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | ||
|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
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* SU-8 resits: 0.1-200+ µm | * SU-8 resits: 0.1-200+ µm | ||
* AZ 5214E: 1.5-3 µm | * AZ 5214E: 1.5-3 µm | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
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* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers (vacuum chuck only) | * 150 mm wafers (vacuum chuck only) | ||