Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

Revision as of 08:45, 18 March 2020

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Thickness measurer

There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.

The user manual, technical information and contact information can be found in LabManager:

Thickness measurer Thickness measurer (wafers)

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.

Equipment performance and process related parameters

Purpose	Thickness measurer	Wafer thickness Depths of larger grooves Heigth of larger samples
Performance	Thickness resolution	< 1 µm
Substrates	Batch size	One sample
Substrates	Substrate materials allowed	No restrictions

Purpose	Thickness measurer (wafers)	Wafer thickness Depths of larger grooves
Performance	Thickness resolution	< 1 µm
Substrates	Batch size	One sample
Substrates	Substrate materials allowed	Only wafers

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 | style="background:LightGrey; color:black"|Substrate materials allowed
 |style="background:WhiteSmoke; color:black"|
-*No restrictions
+*Only wafers
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