Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
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*Wafer thickness | *Wafer thickness | ||
*Depths of larger grooves | *Depths of larger grooves | ||
*Heigth of larger | *Heigth of larger samples | ||
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Thickness resolution | Thickness resolution | ||
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*< | *< 1 µm | ||
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Substrates | |||
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Batch size | |||
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*One sample | |||
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| style="background:LightGrey; color:black"|Substrate materials allowed | |||
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*No restrictions | |||
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Purpose | |||
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Thickness measurer (wafers) | |||
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*Wafer thickness | |||
*Depths of larger grooves | |||
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!style="background:silver; color:black" align="center"| | |||
Performance | |||
|style="background:LightGrey; color:black"| | |||
Thickness resolution | |||
|style="background:WhiteSmoke; color:black"| | |||
*< 1 µm | |||
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Revision as of 08:44, 18 March 2020
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Thickness measurer
There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
The user manual, technical information and contact information can be found in LabManager:
Thickness measurer Thickness measurer (wafers)
Quality Control - Recipe Parameters and Limits
Quality Control (QC) for the Thickness measurer |
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
Purpose |
Thickness measurer |
|
---|---|---|
Performance |
Thickness resolution |
|
Substrates |
Batch size |
|
Substrate materials allowed |
|
Purpose |
Thickness measurer (wafers) |
|
---|---|---|
Performance |
Thickness resolution |
|
Substrates |
Batch size |
|
Substrate materials allowed |
|