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Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions

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= Process optimization using the Picoscope =
= Process optimization using the Picoscope =


The Pegasus tools were delivered with a set of standard recipes
The original standard recipes on Pegasus 1 differ in many ways. The second step of one of them is listed below:
 
{| {{table}}
 
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:500px"
! colspan="3" |Process A parameters
|-
! colspan="2" | Step 2
|-
! width="120" | Parameter 
! width="120" | Etch
! width="120" | Dep
|-
! Gas flow (sccm)
| SF<sub>6</sub> 350 (1.5 s) 550
| C<sub>4</sub>F<sub>8</sub> 200
|-
! Cycle time (secs)
| 7.0
| 4.0
|-
! Pressure (mtorr)
| 25 (1.5 s) 150
| 25
|-
! Coil power (W)
| 2800
| 2000
|-
! Platen power (W)
| 140 (1.5) 45
| 0
|-
! Cycles 
| colspan="2" | 44 (vary this)
|-
! Common
| colspan="2" | Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers
|-
|}


<gallery caption="4 cycles of Process A " widths="400" heights="500" perrow="2">
<gallery caption="4 cycles of Process A " widths="400" heights="500" perrow="2">