Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
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| Sputter deposition of Ag | | Sputter deposition of Ag | ||
| Sputter deposition of Ag | | Sputter deposition of Ag | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
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| RF Ar clean | | RF Ar clean | ||
| RF Ar clean | | RF Ar clean | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
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|10Å to 2000Å | |10Å to 2000Å | ||
|10Å to about 3000Å | |10Å to about 3000Å | ||
|10Å to about 1000Å | |10Å to about 1000Å | ||
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|Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook). | |Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook). | ||
|Dependent on process parameters. | |Dependent on process parameters. | ||
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*1x4" wafers or | *1x4" wafers or | ||
*smaller pieces | *smaller pieces | ||
|-style="background:Lightgrey; color:black" | |-style="background:Lightgrey; color:black" | ||
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* SU-8 | * SU-8 | ||
* Metals | * Metals | ||
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| Pumpdown approx 10 min. | | Pumpdown approx 10 min. | ||
| Only very thin layers. Pumpdown approx 1 hour. | | Only very thin layers. Pumpdown approx 1 hour. | ||
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Revision as of 11:14, 17 March 2020
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Deposition of Silver
Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.
Sputter deposition of Silver
Thermal deposition of Silver
| E-beam evaporation (Temescal) | Thermal evaporation (Thermal Evaporator) | Thermal evaporation (Wordentec) | E-beam evaporation (Physimeca) | Sputter deposition (Wordentec) | Sputter deposition (Lesker) | |
|---|---|---|---|---|---|---|
| General description | E-beam deposition of Ag | Thermal deposition of Ag | Thermal deposition of Ag | E-beam deposition of Ag | Sputter deposition of Ag | Sputter deposition of Ag |
| Pre-clean | Ar ion beam bombardment | none | RF Ar clean | none | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm* | 10Å to 0.5µm ** | 10Å to 0.5µm **(0.5µm not on all wafers) | 10Å to 2000Å | 10Å to about 3000Å | 10Å to about 1000Å |
| Deposition rate | 1 to 10Å/s | 5Å/s | 1 to 10Å/s | 1 to 10Å/s | Depending on process parameters (also written in the logbook). | Dependent on process parameters. |
| Batch size |
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very bad uniformity above 4" wafers |
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| Allowed materials |
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| Comment | Pumpdown approx 20 min. Possible to tilt the wafer. | Pumpdown approx 10 min. | Only very thin layers. Pumpdown approx 1 hour. |
* For thicknesses above 600 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk
** For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk
*** Please ask responsible staff for 8" wafer holder