Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

← Older editNewer edit →
VisualWikitext
Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
Line 252: Line 252:
This is a small study of which aluminium deposition that is best for aluminium lift-off on ZEP520A resist and a very thin layer of aluminium (~20nm). The grain size is compared for the different methods.
This is a small study of which aluminium deposition that is best for aluminium lift-off on ZEP520A resist and a very thin layer of aluminium (~20nm). The grain size is compared for the different methods.


The conclusion was that e-beam evaporation of aluminium in the Alcatel at 15Å/s gave the best result.
The conclusion was that e-beam evaporation of aluminium at 15 Å/s gave the best result.


See details of the study [[/Aluminium deposition on ZEP520A for lift-off|here]].
See details of the study [[/Aluminium deposition on ZEP520A for lift-off|here]].
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium"