Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

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 ==Aluminium deposition on AZ5214 for lift-off==
-Negative photolithographi process is recomended.
+Negative photolithography process is recomended.
-Positive photolithographi process from 1,5µ is possible especially for thin layers of metal.
+Positive photolithography process from 1,5 µm is possible especially for thin layers of metal.
 The more pattern the easyer lift.
+It was tried (jan09) to lift 2.5 µm Al on 4.2µ negative resist on top of 11 µm Apox SiO2 in an acetone sonic-bath.
-It was tried(jan09) to lift 2,5µ Al on 4,2µ negative resist on top of 11µ Apox SiO2 in acetone sonic-bath.
+The Al deposition process was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2E-6.
-This process was done in steps evaporating 5000Å a time with 5min pause and pressure down to at least 2E-6.
 ==Roughness of thermally evaporated aluminium==
 A study by AFM was performed to examine Al films deposited with thermal evaporation in the Wordentec. See details [[/Roughness of thermally evaporated aluminium|here]].