Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! E-beam evaporation (Alcatel) | ! E-beam evaporation (Alcatel) | ||
! E-beam evaporation (Leybold) | ! E-beam evaporation (Leybold) | ||
! Thermal | ! Thermal evaporation (Wordentec) | ||
|- | |- | ||
| Batch size | | Batch size | ||
| Line 23: | Line 23: | ||
|RF Ar clean | |RF Ar clean | ||
|Ar ion bombartment | |Ar ion bombartment | ||
|Ar clean | |RF Ar clean | ||
|- | |- | ||
| Layer thickness | | Layer thickness | ||
Revision as of 10:47, 29 January 2009
Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | Thermal evaporation (Wordentec) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 0.5µm (not on all wafers) |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 1Å to 10 Å/s |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec