Specific Process Knowledge/Back-end processing/Hot Embosser: Difference between revisions
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|style="background:LightGrey; color:black"|Press Plates Temperature | |style="background:LightGrey; color:black"|Press Plates Temperature | ||
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* | *Temperatures close to the glass transition temperature of the polymer give the best results when it comes to pattern replication. | ||
* | *Temperatures that are 5 degrees above the glass transition temperatures give the best results when bonding lids on top of chips | ||
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|style="background:LightGrey; color:black"|Press Plates Pressure | |style="background:LightGrey; color:black"|Press Plates Pressure | ||
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* | *Pressures vary depending on the process. Typically when bonding chips lower pressures are preferred, when imprinting or embossing higher pressures give the best results | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | ||
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*0-285 degrees Celsius | *0-285 degrees Celsius | ||
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|style="background:LightGrey; color:black"|Pressure | |style="background:LightGrey; color:black"|Pressure | ||