Revision as of 11:30, 26 February 2020

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Name of equipment

Write a short description of the equipment(s).

Image(s) of the equipment(s)

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Hot Embosser in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment		Equipment 1
Purpose		Hot Embossing Chip Bonding
Performance	Press Plates Temperature	Upper Plate max temperature 285 degrees Celsius Lower Plate max temperature 285 degrees Celsius
Performance	Press Plates Pressure	Max pressure allowed 250 bar
Process parameter range	Parameter 1	Range
Process parameter range	Parameter 2	Range
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
	Allowed materials	Allowed material 1 Allowed material 2

@@ Line 40: / Line 40: @@
 |style="background:LightGrey; color:black"|Press Plates Temperature
 |style="background:WhiteSmoke; color:black"|
-*Upper Plate max temperature 275 degrees Celsius
+*Upper Plate max temperature 285 degrees Celsius
-*Lower Plate max temperature 275 degrees Celsius
+*Lower Plate max temperature 285 degrees Celsius
 |-